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  • Direct Copper Interconnection for Advanced Semiconductor Technology
    Direct Copper Interconnection for Advanced Semiconductor Technology

    In the “More than Moore” era, performance requirements for leading edge semiconductor devices are demanding extremely fine pitch interconnection in semiconductor packaging.Direct copper interconnection has emerged as the technology of choice in the semiconductor industry for fine pitch interconnection, with significant benefits for interconnect density and device performance.Low-temperature direct copper bonding, in particular, will become widely adopted for a broad range of highperformance semiconductor devices in the years to come. This book offers a comprehensive review and in-depth discussions of the key topics in this critical new technology.Chapter 1 reviews the evolution and the most recent advances in semiconductor packaging, leading to the requirement for extremely fine pitch interconnection, and Chapter 2 reviews different technologies for direct copper interconnection, with advantages and disadvantages for various applications.Chapter 3 offers an in-depth review of the hybrid bonding technology, outlining the critical processes and solutions.The area of materials for hybrid bonding is covered in Chapter 4, followed by several chapters that are focused on critical process steps and equipment for copper electrodeposition (Chapter 5), planarization (Chapter 6), wafer bonding (Chapter 7), and die bonding (Chapter 8).Aspects related to product applications are covered in Chapter 9 for design and Chapter 10 for thermal simulation.Finally, Chapter 11 covers reliability considerations and computer modeling for process and performance characterization, followed by the final chapter (Chapter 12) outlining the current and future applications of the hybrid bonding technology.Metrology and testing are also addressed throughout the chapters.Business, economic, and supply chain considerations are discussed as related to the product applications and manufacturing deployment of the technology, and the current status and future outlook as related to the various aspects of the ecosystem are outlined in the relevant chapters of the book. The book is aimed at academic and industry researchers as well as industry practitioners, and is intended to serve as a comprehensive source of the most up-to-date knowledge, and a review of the state-of-the art of the technology and applications, for direct copper interconnection and advanced semiconductor packaging in general.

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  • Breath Tester Alcohol Tester Semiconductor Sensor Technology Digital
    Breath Tester Alcohol Tester Semiconductor Sensor Technology Digital

    You can start detection, please stop blowing within 10 seconds, the blowing time is at least 5 seconds Press the power button for 2 seconds to start the device, wait 15 seconds to warm up With sensitive semiconductor sensor, the alcohol content shows accurately within seconds. 5 seconds after completing the test, the breathalyzer automatically turns off to save power Breathalyzer offers you a highly accurate test result, reliably tolerates high values. The blue background light makes it easy to read even at night Description: Breathalyzer has an advanced plane alcohol sensor that can respond quickly. The alcohol tester is designed to save power and indicate low voltage. The performance is very stable, and the test results are displayed on the LCD screen with light blue backup.Alcohol Tester is easy to put in wallet or pocket, hang on the key chain, or put in the car for easy carrying. Feature: Alcohol tester Color:White. Material:ABS. Size:12x4.3x2.1cm/4.72x1.69x0.82inch. When the alcohol content exceeds the preset limit value, it can easily display the degree of alcohol poisoning in the body in a few seconds. 1*Alcohol Tester 6*Mouthpieces

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  • Semiconductor Nanolasers
    Semiconductor Nanolasers

    This unique resource explains the fundamental physics of semiconductor nanolasers, and provides detailed insights into their design, fabrication, characterization, and applications.Topics covered range from the theoretical treatment of the underlying physics of nanoscale phenomena, such as temperature dependent quantum effects and active medium selection, to practical design aspects, including the multi-physics cavity design that extends beyond pure electromagnetic consideration, thermal management and performance optimization, and nanoscale device fabrication and characterization techniques.The authors also discuss technological applications of semiconductor nanolasers in areas such as photonic integrated circuits and sensing.Providing a comprehensive overview of the field, detailed design and analysis procedures, a thorough investigation of important applications, and insights into future trends, this is essential reading for graduate students, researchers, and professionals in optoelectronics, applied photonics, physics, nanotechnology, and materials science.

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  • Physics of Semiconductor Devices
    Physics of Semiconductor Devices

    The new edition of the most detailed and comprehensive single-volume reference on major semiconductor devices The Fourth Edition of Physics of Semiconductor Devices remains the standard reference work on the fundamental physics and operational characteristics of all major bipolar, unipolar, special microwave, and optoelectronic devices.This fully updated and expanded edition includes approximately 1,000 references to original research papers and review articles, more than 650 high-quality technical illustrations, and over two dozen tables of material parameters. Divided into five parts, the text first provides a summary of semiconductor properties, covering energy band, carrier concentration, and transport properties.The second part surveys the basic building blocks of semiconductor devices, including p-n junctions, metal-semiconductor contacts, and metal-insulator-semiconductor (MIS) capacitors.Part III examines bipolar transistors, MOSFETs (MOS field-effect transistors), and other field-effect transistors such as JFETs (junction field-effect-transistors) and MESFETs (metal-semiconductor field-effect transistors).Part IV focuses on negative-resistance and power devices.The book concludes with coverage of photonic devices and sensors, including light-emitting diodes (LEDs), solar cells, and various photodetectors and semiconductor sensors.This classic volume, the standard textbook and reference in the field of semiconductor devices: Provides the practical foundation necessary for understanding the devices currently in use and evaluating the performance and limitations of future devices Offers completely updated and revised information that reflects advances in device concepts, performance, and application Features discussions of topics of contemporary interest, such as applications of photonic devices that convert optical energy to electric energy Includes numerous problem sets, real-world examples, tables, figures, and illustrations; several useful appendices; and a detailed solutions manual for Instructor's onlyExplores new work on leading-edge technologies such as MODFETs, resonant-tunneling diodes, quantum-cascade lasers, single-electron transistors, real-space-transfer devices, and MOS-controlled thyristors Physics of Semiconductor Devices, Fourth Edition is an indispensable resource for design engineers, research scientists, industrial and electronics engineering managers, and graduate students in the field.

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  • What is the complexity of semiconductor technology or microsystems technology?

    The complexity of semiconductor technology or microsystems technology is high due to the intricate processes involved in designing, manufacturing, and integrating tiny electronic components. These technologies require precise control at the nanoscale level, involving complex materials, intricate fabrication techniques, and sophisticated equipment. Additionally, the rapid pace of innovation and the need for continuous improvement in performance and miniaturization add to the complexity of these technologies. As a result, semiconductor and microsystems technology require significant expertise, resources, and investment to develop and produce advanced electronic devices.

  • What is a semiconductor dosimeter?

    A semiconductor dosimeter is a type of radiation dosimeter that uses semiconductor materials to measure and detect ionizing radiation. These dosimeters are commonly used in medical, industrial, and research settings to monitor radiation exposure levels. Semiconductor dosimeters are known for their high sensitivity, accuracy, and ability to provide real-time measurements of radiation doses. They are often small, portable, and easy to use, making them a popular choice for radiation monitoring applications.

  • How does a semiconductor work?

    A semiconductor works by controlling the flow of electrical current through it. It has properties that allow it to conduct electricity under certain conditions and act as an insulator under others. By adding impurities to the semiconductor material, a process known as doping, it is possible to manipulate its electrical properties and create electronic devices such as diodes, transistors, and integrated circuits. When a voltage is applied to a semiconductor device, it can either allow current to flow through it (in the case of a diode or transistor) or amplify the current (in the case of a transistor).

  • What is a semiconductor diode?

    A semiconductor diode is a two-terminal electronic component that allows current to flow in one direction only. It is made of semiconductor material, typically silicon or germanium, with a junction between two different types of semiconductors. When a voltage is applied across the diode in the forward direction, it allows current to flow easily, but in the reverse direction, it blocks the current flow. Semiconductor diodes are commonly used in various electronic circuits for rectification, signal demodulation, and voltage regulation.

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  • History of Semiconductor Engineering
    History of Semiconductor Engineering

    performing ?rms were curtailed following the stock market decline and the subsequent economic slowdown of 2001 and 2002.The Federal Government was once the main source of the nation’s R&D funds, funding as much as 66. 7 percent of all U. S. R&D in 1964. The Federal share ?rst fell below 50 percent in 1979, and after 1987 it fell steadily, dr- ping from 46. 3 percent in that year to 25. 1 percent in 2000 (the lowest it has ever been since 1953).Adjusting for in?ation, Federal support decreased 18 percent from 1987 to 2000, although in nominal terms, Federal support grew from $58. 5 billion to $66. 4 billion during that period. Growth in industrial funding generally outpaced growth in Federal support, leading to the decline in Federal support as a proportion of the total.Fig. 2. Doctorates awarded in Engineering, Physics, and Mathematics: 1995–2002 [Source: National Science Foundation NSF 04–303 (October 2003)] Figure 1 explains the most signi?cant change in the industry which occurred in the early sixties.The industry, with pressure from Wall Street, could not ?nance long-range and risky basic research.The objective of basic research is to gain more comprehensive knowledge or understanding of the subject under study without speci?c applications in mind.Basic research advances scienti?c knowledge but does not have speci?c immediate commercial objectives.Basic research can fail and often will not bring results in a short period of time.

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  • Semiconductor Memory Devices and Circuits
    Semiconductor Memory Devices and Circuits

    This book covers semiconductor memory technologies from device bit-cell structures to memory array design with an emphasis on recent industry scaling trends and cutting-edge technologies.The first part of the book discusses the mainstream semiconductor memory technologies.The second part of the book discusses the emerging memory candidates that may have the potential to change the memory hierarchy, and surveys new applications of memory technologies for machine/deep learning applications.This book is intended for graduate students in electrical and computer engineering programs and researchers or industry professionals in semiconductors and microelectronics. Explains the design of basic memory bit-cells including 6-transistor SRAM, 1-transistor-1-capacitor DRAM, and floating gate/charge trap FLASH transistor Examines the design of the peripheral circuits including the sense amplifier and array-level organization for the memory array Examines industry trends of memory technologies such as FinFET based SRAM, High-Bandwidth-Memory (HBM), 3D NAND Flash, and 3D X-point array Discusses the prospects and challenges of emerging memory technologies such as PCM, RRAM, STT-MRAM/SOT-MRAM and FeRAM/FeFET Explores the new applications such as in-memory computing for AI hardware acceleration.

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  • Direct Conversion Semiconductor Radiation Detectors
    Direct Conversion Semiconductor Radiation Detectors


    Price: 120.00 £ | Shipping*: 0.00 £
  • Semiconductor Process Reliability in Practice
    Semiconductor Process Reliability in Practice

    Publisher's Note: Products purchased from Third Party sellers are not guaranteed by the publisher for quality, authenticity, or access to any online entitlements included with the product. Proven processes for ensuring semiconductor device reliabilityCo-written by experts in the field, Semiconductor Process Reliability in Practice contains detailed descriptions and analyses of reliability and qualification for semiconductor device manufacturing and discusses the underlying physics and theory.The book covers initial specification definition, test structure design, analysis of test structure data, and final qualification of the process.Real-world examples of test structure designs to qualify front-end-of-line devices and back-end-of-line interconnects are provided in this practical, comprehensive guide. Coverage includes:Basic device physicsProcess flow for MOS manufacturingMeasurements useful for device reliability characterizationHot carrier injectionGate-oxide integrity (GOI) and time-dependentdielectric breakdown (TDDB)Negative bias temperature instabilityPlasma-induced damageElectrostatic discharge protection of integrated circuitsElectromigrationStress migrationIntermetal dielectric breakdown

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  • Isn't the NTC thermistor a semiconductor?

    Yes, the NTC (Negative Temperature Coefficient) thermistor is a type of semiconductor. It is made from semiconductor materials such as metal oxides like manganese, nickel, and cobalt. The resistance of the NTC thermistor decreases as the temperature increases, making it a useful component in temperature sensing and control applications.

  • Why is fullerene only a semiconductor?

    Fullerene is only a semiconductor because of its unique structure and electronic properties. The carbon atoms in fullerene are arranged in a closed cage-like structure, which creates a limited number of energy levels for electrons to occupy. This limited number of energy levels results in a small band gap between the valence and conduction bands, making fullerene a semiconductor rather than a conductor or insulator. Additionally, the symmetrical arrangement of carbon atoms in fullerene allows for efficient electron delocalization, which is characteristic of semiconductor materials.

  • What is a semiconductor in physics?

    A semiconductor is a material that has electrical conductivity between that of a conductor and an insulator. This means that semiconductors can conduct electricity under certain conditions but not as easily as conductors. Semiconductors are a key component in electronic devices such as transistors, diodes, and integrated circuits, making them essential in modern technology. By controlling the flow of electrons through semiconductors, we can manipulate and amplify electrical signals, enabling the functioning of various electronic devices.

  • Is the NTC thermistor not a semiconductor?

    The NTC (Negative Temperature Coefficient) thermistor is indeed a semiconductor. It is made of semiconductor materials such as metal oxides like manganese, nickel, and cobalt. These materials exhibit a decrease in resistance with an increase in temperature, which is the basis of how NTC thermistors function. Therefore, NTC thermistors are considered semiconductor devices.

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